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National
One-chip mobile phone coming: TI chief
By Anand Parthasarathy
Bangalore Aug. 7. Digital and analogue chip-maker, Texas Instruments (TI), expects to roll out by year-end, a single chip which combines all the circuits that go into a mobile phone. This will make cell phones, much smaller, less power-hungry — and cheaper.
The TI's chief executive officer, Rich Templeton, said here on Friday that the chip would combine all the key elements that go into a mobile phone — the radio circuits, digital processor, memory and power management circuits — leaving just the battery power source outside. Making radio and audio circuits work on the same slab of silicon, without interfering with each other, had been a challenge for chip designers for decades — and TI expects to be first off the block with a one-chip "Digital Radio Frequency Processor" for the Global Services Mobile (GSM) — end of the mobile market.
Similar solution
The company is also working on a similar solution for the other mobile technology — Code Division Multiple Access (CDMA) — and is known to be working with the Japanese telecom company, DoCoMo, on a chip for the third Generation (3G) Wideband CDMA market.
Mr. Templeton who took over as TI's head in May, was on his maiden visit to India, to inaugurate the company's new 27,000 sq. metre facility, within a 7-acre campus, a part of the up-and-coming Bagmane Tech Park, near the HAL airport.
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