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SPEL Semiconductor to expand

CHENNAI: SPEL Semiconductor Ltd. is planning to increase the capacity of its existing semiconductor IC assembly and test facilities. It is currently installing state-of-the-art LMP (leadless molded package). It has also proposed to introduce two other new package lines. The company has stated in a release that it has chalked out plans involving an investment of $250 million which include the setting up of second facility within India as well as supporting a proposed overseas acquisition.

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